Laser edge banding is a new type of edge banding technology that does not require any additional coating system. Laser sol edge banding technology uses a 3D laser emitter to generate a high-energy density beam of light that illuminates the laser edge banding strip, causing it to melt under laser irradiation. The bonding performance is good, and it can perfectly combine the board and edge banding strip, completely seamless bonding, wear resistance, moisture resistance, and heat resistance are also better, It is truly seamless edge sealing. Laser is further divided into rectangular laser and 3D laser.

Characteristics of rectangular laser edge banding machine: surface heating scanning semiconductor spot edge banding, more stable and soft.