The characteristics of PUR hot melt adhesive are high cohesive strength and high bonding strength. Good high-temperature and low-temperature resistance, far superior to ordinary hot melt adhesives. The main difference between the two lies in the use of equipment, as well as the storage environment and methods. PUR hot melt adhesive must be isolated to avoid contact with air due to its ability to react with moisture in the air. PUR hot melt adhesive is a popular adhesive for screen bonding and is widely used in various fields.

The advantages of using PUR structural adhesive in the field of electronic products are:

1. PUR structural adhesive has high curing strength and can meet the bonding requirements of the vast majority of electronic products.

2. PUR structural adhesive has good insulation performance.

3. PUR structural adhesive has good weather resistance, aging resistance, and high and low temperature resistance.

4. PUR structural adhesive has a lower gluing temperature.

5. PUR structural adhesive belongs to thermoplastic polyurethane, and using PUR structural adhesive to bond products is easier to disassemble and repair.

6. PUR structural adhesive makes it easier to control the thickness of the adhesive, and can be applied with adhesive lines as thin as 1mm, which can meet the design requirements of current narrow bezel smartphones.

Based on the above characteristics of PUR structural adhesive, it is determined that PUR structural adhesive has more advantages in bonding in the field of electronic products compared to other adhesives.

Main applications: smart wearables, mobile phones, tablets.

PUR structural adhesive has become a new favorite in the industry for bonding, sealing, lamination, connection, insulation, electronic protection, and assembly. Specific applications include assembly of screen components for smartphones and tablets, learning machines, GPS navigators, wearable electronic devices, window bonding, shell structure bonding, battery bonding, flat sealing, PCB assembly and protection, and so on.